Thermal Design for CPO Microring Modulators
1. The Evolution of CPO and the Thermal Bottleneck of Microring Modulators The explosive growth of AI computing clusters and the evolution of data center interconnection rates to 100Gbps/lane and above have driven the transformation of Co-Packaged Optics (CPO) technology from concept to large-scale deployment. Its core value lies in breaking the traditional discrete architecture […]