High - performance liquid cooling plates are designed to address the heat dissipation issues of Intel CPUs. These advanced cooling solutions, with efficient heat transfer structures, can effectively absorb and dissipate the heat generated by Intel CPUs, ensuring their stable operation under high - load conditions.
What is a intel eagle stream CPU?
It is Intel’s 4th and 5th Generation Xeon Scalable Processor platforms. Here’s the introduction:
• Target Scenarios:
Primarily designed for 1P, 2P, 4P, and 8P servers, it is Intel’s first DDR5 server platform.
• Technical Features:
Utilizes enhanced SuperFin technology, built on Intel 7 processors. It supports eight memory channels per processor, features PCIe 5.0 and Compute Express Link 1.1, and integrates Intel Advanced Matrix Extensions (AMX) for scalable built-in AI acceleration.
• Processor Models:
The 4th generation (codename Sapphire Rapids) supports DDR5 at speeds up to 4800MT/s; the 5th generation (codename Emerald Rapids) supports DDR5 at up to 5600MT/s.
• Performance Advantages:
Delivers higher memory bandwidth, hardware-enhanced security, and focuses on improving performance for AI, multi-cloud workloads, virtual networks, and 5G
How to design 350w intel eagle stream liquid cooling plate?
Thermal Power:
We determine the power of intel eagle Stream CPU. Since it supports two 4th Gen Intel Xeon Scalable Processors, the maximum thermal design power (TDP) of a single processor is 350W. We thus calculate based on its heat output, with a maximum of 350W. To dissipate heat from the CPU cores, we use a full-copper material and employ a skived fin process, allowing the fluid to pass through fin structures to carry away 350W of heat.
Cold plate resistance:
Additionally, we consider flow resistance testing. When multiple servers (even ten or more) run simultaneously, flow resistance can increase significantly, making it a critical parameter for system stability. Overall, our design for this full-copper liquid cooling solution is based on heat loads of 300W to 350W to ensure effective heat dissipation.
350w intel eagle stream liquid cooling plate produced by Kenfa.
How is it manufactured by Kenfa tech? First, we use C102 copper material for the core part of the liquid cooling plate—the heat source section in contact with the CPU. Typically, Using the skived fin process ,the copper base plate has a thickness of 1.5 mm, while the fin height is 10 mm, with a fin thickness of 0.1 mm and a spacing of 0.1 mm. Such a dense structure allows efficient absorption of substantial heat from the CPU onto the fins, where coolant flowing through the fins carries away the heat.
Cover plate is then precision-machined via CNC, and both the base plate and cover plate are welded together using FSW (friction stir welding) technology. The inlet and outlet ports are also welded with FSW.Next, an aluminum frame produced by die-casting is used to secure the copper cooling core and aluminum components together with screws. Finally, four springs are designed to meet Intel CPU standards, enabling customers to use our developed liquid cooling plate for standard Intel Stream 350W CPU cooling.
Custom Design vs. Standard Product Selection
With over a decade of manufacturing experience, we offer complete design capabilities for heat dissipation solutions across all Intel CPU types—from air cooling to liquid cooling and immersion cooling systems—to meet diverse customer needs. We specialize in fully customized designs, supporting clients through every stage: from initial design and prototyping to testing, mass production, after-sales service, and product improvement.To reduce customer development and market pressure, we also provide a wide range of standard products. These can be directly integrated into clients’ systems, saving both costs and time to market. Whether clients require tailored solutions or off-the-shelf products, our end-to-end process ensures high-quality, efficient service.
NVIDIA H100 liquid cooling plate
intel birch liquid cooling plate
NVIDIA GB200 liquid cooling plate
