Design and 500W-Level Heat Dissipation Performance Verification of M-Type Copper Tube-Embedded Four-Channel Liquid Cooling Plate
Abstract To address the heat dissipation requirements of 500W high-power devices, this study designs an M-type copper tube-embedded four-channel liquid cooling plate. Based on a base plate dimension of 127mm×152mm×15.2mm, four sets of M-type flow channels are constructed using copper tubes with an outer diameter of 9.52mm and a wall thickness of 1.24mm. Combined with […]
1kW Copper Tube Embedded Liquid Cooling Plate
Abstract To meet the efficient heat dissipation requirements of 1kW high-power electronic devices (such as high-power server CPUs and industrial inverter modules), this paper designs a six-channel copper tube embedded liquid cooling plate. Based on a 6063-T5 aluminum alloy base plate with dimensions of 177.8mm×152mm×14mm, six groups of parallel flow channels are constructed using copper […]