Optimization Design of High-Power-Density Chip Heat Dissipation Based on Double-Layer Stacked Liquid Cooling Plate——Drawing on Huawei Tau (τ) Three-Dimensional Hierarchical Architecture
1. Introduction With the continuous iteration of semiconductor chip manufacturing processes and the rapid upgrading of computing power, the power density of high-end chips has increased significantly. Traditional planar heat dissipation structures are limited by fixed heat exchange area, long heat conduction paths and high heat loss, which can hardly adapt to high-load and high-heat-flux […]