Huawei and Qualcomm Broad Patent License Agreement: Thermal Management Is The Underlying Foundation for 5G & AI Chip Performance
Abstract:The Huawei-Qualcomm cross-licensing patent deal unlocks next-generation 5G and AI chip innovation. This article explains why high-performance heat sinks and liquid cold plates become critical to release full chip computing power. 1.What Happened Huawei and Qualcomm recently announced a multi-year, broad patent license agreement. The deal covers cross-licensing of patent portfolios across 5G, computing, artificial […]