Copper-Aluminum Explosion-Welded Heat Sink
Copper-Aluminum Bonding via Explosive Welding heat sink : Principles, Production Processes, Applications and Key Considerations In fields such as electronic thermal management, IGBT ,new energy power systems, and rail transit, copper-aluminum composite materials have emerged as ideal alternatives to pure copper components, leveraging copper’s excellent electrical and thermal conductivity alongside aluminum’s advantages of light weight […]
340Ah/104-Series Battery cells liquid cold plate
Design and Verification of a Liquid Cooling Plate Heat Dissipation Solution for 340Ah/104-Series Battery Modules Driven by the “dual carbon” goals, the energy storage industry is ushering in a golden era of large-scale development. Lithium-ion batteries, as the core components of energy storage systems, have their thermal management capabilities directly determining the system’s safety, cycle […]
Application of Thermoelectric Cooling Chips in Dehumidifiers
Application of Thermoelectric Cooling Chips in Dehumidifiers.Design and Dehumidification Application of TEC Semiconductor Cooling Chip Based on Acetone Heat Pipe and Skived Fin Heat Sink，In places such as libraries and museums, the preservation of high-precision cultural relics and equipment imposes stringent requirements on environmental humidity control. Traditional compressor-based dehumidification equipment suffers from drawbacks including high […]
A Production Process of Turbulence-Enhanced Bent Channel Tubed Liquid Cold Plate
This invention introduces a turbulence-enhanced bent channel liquid cold plate using a 6061-T5 aluminum substrate with embedded red copper tubes forming M-shaped flows. Key features include 30° “horizontal-downward-lifting” bends in straight sections to generate turbulence, improving convective heat transfer by over 10% while limiting flow resistance rise to under 10%. Simulations confirm reduced chip temperatures and enhanced efficiency compared to traditional straight-pipe designs, making it suitable for high-power electronics and batteries without added internals.
How to design AI Chip Test Fixtures
Core Equipment for Reliability Verification: Technological Breakthroughs and Application Value of Liquid Cooled Plates Dedicated to AI Chip Test Fixtures In the full process of AI chips from packaging to mass production, reliability verification is a key link that determines product yield and market competitiveness. With the thermal design power (TDP) of high-performance chips such […]
Thermal Management of High-Speed Motors
Thermal Management of High-Speed Motors: Requirements and Practice of Shell Liquid Cooling Heat Dissipation Solutions The popularity of high-speed motors (typically defined as motors with a rotational speed ≥ 10000r/min) in industrial drives, new energy vehicles, aerospace, and other fields has made thermal management capability a core bottleneck restricting performance and lifespan. When a motor […]
New Energy Vehicle Battery Liquid cooling plate Trays Guide
New Energy Vehicle Battery Liquid cooling plate Trays Guide:The Evolution from CNC Precision Prototyping to Gravity Die Casting for Mass Production In the core components of new energy vehicles (NEVs), the battery tray serves as the “safety cornerstone” for holding the power battery pack. Its structural strength, dimensional accuracy, and lightweight performance directly determine the […]
Microchannel Liquid Cooling Plate
I Microchannel Liquid Cooling Plate: A Cooling Savior for High-Power-Density Chips: A Complete Analysis from Process to Design As chip performance continues to break new ground, soaring power density has become an irreversible trend. From AI chips in data centers to IGBT modules in new energy vehicles, local heat flux densities often exceed 100W/cm². Traditional […]
NVIDIA H200 GPU server immersion oil cooling solution
In the era of explosive AI computing power, GPUs, as core computing units, face significant challenges in hardware stability and computing power output due to their heat dissipation efficiency. The power consumption of NVIDIA‘s H200 GPU varies depending on model and usage scenario. The standard model has a thermal design power (TDP) of 700W. The […]