Manufacturer of NVIDIA GB200 Compatible Cold Plates
Abstract NVIDIA GB200 Grace Blackwell Superchip reaches a total thermal load of 2700W. The integrated microchannel cold plate is the core liquid cooling component for high-density AI computing racks. KENFA is a professional manufacturer for GB200 form-fit compatible cold plates. We cover full in-house workflow: thermal simulation, structural design, copper microchannel machining, vacuum brazing, pressure […]
Liquid Metal vs Graphene Thermal Film – A Practical Selection Guide for Thermal Engineers
Overview When working on high-power thermal designs, we get asked this question all the time: for high heat flux applications, should I pick liquid metal or graphene thermal film?Many hardware teams see the high thermal conductivity value of graphene and assume it outperforms all other TIMs. Some engineers also hear about ultra-low thermal resistance of […]
The Importance of Thermal Interface Materials in Thermal Management
The Importance of Thermal Interface Materials in Thermal Management: Understanding the Key Selection Logic from a Thermal Analysis Case of High-Power Equipment With the continuous increase in the power density of electronic devices, heat dissipation issues of high-power chips and industrial power modules have become a core bottleneck restricting equipment reliability. The primary goal of […]
Maximize Heat Dissipation with Die Casting Heatsinks: A Guide
Introduction Heat dissipation remains a top hurdle for engineers designing electronic devices, with overheating slashing component lifespan and performance. Studies show poor thermal management can cut system reliability by up to 50%. That’s where die casting heatsinks step in, offering precision and efficiency to tackle this challenge head-on. At KenFa Tech, we’ve seen how these […]