The Importance of Thermal Interface Materials in Thermal Management
The Importance of Thermal Interface Materials in Thermal Management: Understanding the Key Selection Logic from a Thermal Analysis Case of High-Power Equipment With the continuous increase in the power density of electronic devices, heat dissipation issues of high-power chips and industrial power modules have become a core bottleneck restricting equipment reliability. The primary goal of […]
Maximize Heat Dissipation with Die Casting Heatsinks: A Guide
Introduction Heat dissipation remains a top hurdle for engineers designing electronic devices, with overheating slashing component lifespan and performance. Studies show poor thermal management can cut system reliability by up to 50%. That’s where die casting heatsinks step in, offering precision and efficiency to tackle this challenge head-on. At KenFa Tech, we’ve seen how these […]