Microchannel Liquid Cooling Plate
I Microchannel Liquid Cooling Plate: A Cooling Savior for High-Power-Density Chips: A Complete Analysis from Process to Design As chip performance continues to break new ground, soaring power density has become an irreversible trend. From AI chips in data centers to IGBT modules in new energy vehicles, local heat flux densities often exceed 100W/cm². Traditional […]
How to select a heat sink
As the heat released by microelectronic devices goes up and their overall sizes get smaller and How to select a heat sink？ thermal management turns into a far more vital part of electronic product design. The operational reliability and service life of electronic equipment both have an inverse connection with the temperature of the equipment’s components. […]
Design and Application of High-Power TEC Heat Sinks
Abstract Design and Application of High-Power TEC Heat Sinks – Catering to Temperature Control Requirements of Medical Precision Instruments.With the rapid development of the medical industry and precision instrument field, the sensitivity and precision requirements of equipment for temperature control have significantly increased. Especially in scenarios where the temperature needs to be lower than the […]
Three key parameters for designing AI liquid cooled plates
After determining parameters such as material, coolant, thermal resistance, and flow distribution, the design of an AI liquid cooled plate is far from complete. To ensure the stable, efficient, and long-term operation of the cold plate in practical systems, it is necessary to focus on solving the following three key technical issues: 1) Flow resistance […]
Analysis of Corrosion Issues and Material Selection for Liquid Cooling Plate Channels
In modern thermal management technologies, liquid cooling plates serve as critical components for heat dissipation in electronic devices, industrial machinery, and other fields due to their high-efficiency heat conduction performance. Their working principle relies on the circulation of cooling fluid within the channels, which carries away heat through heat exchange to achieve temperature reduction of […]
Skived fin copper heat sink of Kenfa tech
The microchannel process of copper skived fin is crucial for its application in the field of heat dissipation.In liquid cooled plates, the high thermal conductivity of copper combined with microchannel technology greatly improves heat dissipation efficiency. This can ensure normal temperature during high load operation of electronic devices, avoiding performance and lifespan issues caused by […]
How to optimize the microchannel design of liquid cold plate
Due to the increasing power of electronic devices, the use of air-cooled heat sink is becoming increasingly difficult to meet their requirements. Due to the use of air as the working fluid, it is becoming increasingly difficult to design heat sinks that can dissipate over 100 W/cm2 at the device level. Liquid cold plates have […]
What is a cold forged heat sink?
Cold forged heatsinks are heatsinks manufactured through the cold forging process, widely used in electronic devices, LED lighting, automotive industries, Application of Liquid Cooled Plate Microchannel in IGBT and more. Their unique manufacturing process and material properties provide excellent heat dissipation and structural strength. This article will focus on the different characteristics and parameters of […]
Copper Liquid Cooling Plate VS Aluminum Liquid Cooling Plate
Liquid cooling plates are integral to many cooling systems, serving as vital components for effective heat dissipation. When choosing a liquid cooling plate for your system, there is a significant difference between copper and aluminium materials. Each material has unique benefits and drawbacks that users should carefully examine. This book will cover the distinctions between […]