Thermal Design for CPO Microring Modulators
1. The Evolution of CPO and the Thermal Bottleneck of Microring Modulators The explosive growth of AI computing clusters and the evolution of data center interconnection rates to 100Gbps/lane and above have driven the transformation of Co-Packaged Optics (CPO) technology from concept to large-scale deployment. Its core value lies in breaking the traditional discrete architecture […]
What is a Mechanically Pumped Two-Phase Loop (MPTL)?
In fields such as aerospace thermal control, high-performance computing, and new energy, efficient heat transfer and precise temperature control have always been core technical requirements. Traditional single-phase fluid cooling systems are limited by the bottleneck of sensible heat transfer and are difficult to meet the heat dissipation needs of high-power density equipment. As an efficient […]
340Ah/104-Series Battery cells liquid cold plate
Design and Verification of a Liquid Cooling Plate Heat Dissipation Solution for 340Ah/104-Series Battery Modules Driven by the “dual carbon” goals, the energy storage industry is ushering in a golden era of large-scale development. Lithium-ion batteries, as the core components of energy storage systems, have their thermal management capabilities directly determining the system’s safety, cycle […]
Microchannel Liquid Cooling Plate
I Microchannel Liquid Cooling Plate: A Cooling Savior for High-Power-Density Chips: A Complete Analysis from Process to Design As chip performance continues to break new ground, soaring power density has become an irreversible trend. From AI chips in data centers to IGBT modules in new energy vehicles, local heat flux densities often exceed 100W/cm². Traditional […]
How to select a heat sink
As the heat released by microelectronic devices goes up and their overall sizes get smaller and How to select a heat sink？ thermal management turns into a far more vital part of electronic product design. The operational reliability and service life of electronic equipment both have an inverse connection with the temperature of the equipment’s components. […]
Design and Application of High-Power TEC Heat Sinks
Abstract Design and Application of High-Power TEC Heat Sinks – Catering to Temperature Control Requirements of Medical Precision Instruments.With the rapid development of the medical industry and precision instrument field, the sensitivity and precision requirements of equipment for temperature control have significantly increased. Especially in scenarios where the temperature needs to be lower than the […]
Three key parameters for designing AI liquid cooled plates
After determining parameters such as material, coolant, thermal resistance, and flow distribution, the design of an AI liquid cooled plate is far from complete. To ensure the stable, efficient, and long-term operation of the cold plate in practical systems, it is necessary to focus on solving the following three key technical issues: 1) Flow resistance […]
Analysis of Corrosion Issues and Material Selection for Liquid Cooling Plate Channels
In modern thermal management technologies, liquid cooling plates serve as critical components for heat dissipation in electronic devices, industrial machinery, and other fields due to their high-efficiency heat conduction performance. Their working principle relies on the circulation of cooling fluid within the channels, which carries away heat through heat exchange to achieve temperature reduction of […]
Skived fin copper heat sink of Kenfa tech
The microchannel process of copper skived fin is crucial for its application in the field of heat dissipation.In liquid cooled plates, the high thermal conductivity of copper combined with microchannel technology greatly improves heat dissipation efficiency. This can ensure normal temperature during high load operation of electronic devices, avoiding performance and lifespan issues caused by […]