Blogs

Our engineers will regularly update the new technologies and materials in the field of thermal design in the industry and share them with you for reference, in order to add some inspiration for the subsequent design

Skived fin copper heat sink of Kenfa tech

Skived fin copper heat sink

The microchannel process of copper skived fin is crucial for its application in the field of heat dissipation.
In liquid cooled plates, the high thermal conductivity of copper combined with microchannel technology greatly improves heat dissipation efficiency. This can ensure normal temperature during high load operation of electronic devices, avoiding performance and lifespan issues caused by overheating. Its good stability and corrosion resistance reduce maintenance costs. And its’ small size and light weight enable it to effectively dissipate heat in scenarios that require high space and weight.


In terms of computer computing servers, the servers operate under high load for a long time, and the core components generate a lot of heat. Copper skived fin heat sink can quickly reduce temperature, and probability of failure caused by high temperature. It can also improve server reliability and stability, and extend service life. For high-performance servers, good heat dissipation also provides the possibility of overclocking.