In-depth Analysis of Liquid Cooling Plate Structure Selection and Performance
In-depth Analysis of Liquid Cold Plate Structure Selection and Performance for Thermal Management.Comparison of 5 Schemes Under the Condition of ΔTfluid = 30℃— From the Perspective of Thermal Design Practice, Interpreting the Adaptation Logic and Engineering Value of Different Flow Channel Structures 1. Introduction: Core Pain Points of Liquid Cooling Plate Selection in the High-Power […]
Research on Spiral Flow Channels for Liquid Cooling Plates
Research on Spiral Flow Channels for Liquid Cooling Plates in High Power Electronics Cooling，Aiming at the heat dissipation challenges of high power electronics cooling in limited spaces, this paper designs a U-type liquid cold plate with dimensions of 120mm × 50mm × 20mm. A comparative study is conducted between smooth straight flow channels and spiral […]
Thermal Design for CPO Microring Modulators
1. The Evolution of CPO and the Thermal Bottleneck of Microring Modulators The explosive growth of AI computing clusters and the evolution of data center interconnection rates to 100Gbps/lane and above have driven the transformation of Co-Packaged Optics (CPO) technology from concept to large-scale deployment. Its core value lies in breaking the traditional discrete architecture […]
Thermal Management in Communication Base Stations
Driven by the wave of digitalization, the popularization of 5G communication networks is accelerating, and the research and development of 6G technology is advancing continuously. As the core hub of information transmission, communication base stations have witnessed a significant increase in deployment density and operational load. The continuous improvement in the integration of base station […]
What is a Mechanically Pumped Two-Phase Loop (MPTL)?
In fields such as aerospace thermal control, high-performance computing, and new energy, efficient heat transfer and precise temperature control have always been core technical requirements. Traditional single-phase fluid cooling systems are limited by the bottleneck of sensible heat transfer and are difficult to meet the heat dissipation needs of high-power density equipment. As an efficient […]
Copper-Aluminum Explosion-Welded Heat Sink
Copper-Aluminum Bonding via Explosive Welding heat sink : Principles, Production Processes, Applications and Key Considerations In fields such as electronic thermal management, IGBT ,new energy power systems, and rail transit, copper-aluminum composite materials have emerged as ideal alternatives to pure copper components, leveraging copper’s excellent electrical and thermal conductivity alongside aluminum’s advantages of light weight […]
340Ah/104-Series Battery cells liquid cold plate
Design and Verification of a Liquid Cooling Plate Heat Dissipation Solution for 340Ah/104-Series Battery Modules Driven by the “dual carbon” goals, the energy storage industry is ushering in a golden era of large-scale development. Lithium-ion batteries, as the core components of energy storage systems, have their thermal management capabilities directly determining the system’s safety, cycle […]
Application of Thermoelectric Cooling Chips in Dehumidifiers
Application of Thermoelectric Cooling Chips in Dehumidifiers.Design and Dehumidification Application of TEC Semiconductor Cooling Chip Based on Acetone Heat Pipe and Skived Fin Heat Sink，In places such as libraries and museums, the preservation of high-precision cultural relics and equipment imposes stringent requirements on environmental humidity control. Traditional compressor-based dehumidification equipment suffers from drawbacks including high […]
A Production Process of Turbulence-Enhanced Bent Channel Tubed Liquid Cold Plate
This invention introduces a turbulence-enhanced bent channel liquid cold plate using a 6061-T5 aluminum substrate with embedded red copper tubes forming M-shaped flows. Key features include 30° “horizontal-downward-lifting” bends in straight sections to generate turbulence, improving convective heat transfer by over 10% while limiting flow resistance rise to under 10%. Simulations confirm reduced chip temperatures and enhanced efficiency compared to traditional straight-pipe designs, making it suitable for high-power electronics and batteries without added internals.