Huawei and Qualcomm Broad Patent License Agreement: Thermal Management Is The Underlying Foundation for 5G & AI Chip Performance
Abstract:The Huawei-Qualcomm cross-licensing patent deal unlocks next-generation 5G and AI chip innovation. This article explains why high-performance heat sinks and liquid cold plates become critical to release full chip computing power. 1.What Happened Huawei and Qualcomm recently announced a multi-year, broad patent license agreement. The deal covers cross-licensing of patent portfolios across 5G, computing, artificial […]
KENFA Team Attends ANSYS Fluent Thermal Simulation Training to Enhance Technical Capabilities
Abstract:KENFA’s engineering team participated in the ANSYS Fluent special training on thermal simulation held in Dongguan. The training focused on ANSYS CFD software upgrades, new functional modules and engineering applications of fluid and heat transfer simulation. During the session, our engineers had in-depth technical exchanges with the senior simulation instructor, discussing simulation challenges and implementation […]
A Guide to Anti-Corrosion Treatment of Heat pipe Heat Sinks for Outdoor Equipment
Abstract:Outdoor high-power inverters, LED stage lights, and energy storage IGBT devices consistently operate under harsh working conditions including high thermal load, outdoor humid and salt spray environments, and dust weathering. Conventional thin-walled heat pipe radiators commonly suffer from insufficient structural strength, easy deformation, corrosion, and rapid heat dissipation attenuation. Based on practical engineering experience, this […]
Thermosiphon thermal management Technical Guide
A practical technical guide to thermosiphon heat exchangers: passive, two-phase cooling with no pump and no moving parts—ideal for AI servers, energy storage, and inverters.
CIOE 2026: AI & Optoelectronics Converge
At CIOE 2026, AI and optoelectronics converge—pushing thermal limits in optical modules, CPO, and AI computing servers. Explore KenFa Tech’s full-stack cooling solutions.
Liquid Cooling Plate with Integrated Heat Exchanger
Abstract Liquid Cooling Plate with Integrated Heat Exchanger – Compact High-Efficiency Thermal Management Solution.Liquid cooling plate and heat exchanger are core thermal management components for high-power electronic and energy storage equipment. Traditional thermal solutions adopt split layouts of independent liquid cooling plates and external heat exchangers, which suffer from excessive assembly accessories, large space occupation, […]
Thermal Performance Research & Structural Design of Heat Pipe Heat Sink for 4000W LED Searchlight
Abstract A heat pipe heat sink is developed to address the high heat flux cooling challenge of a 4000W high-power LED searchlight. The overall dimension of the radiator is 350mm×350mm×120mm, equipped with 40 pieces of Φ9.5 mm heat pipes. A 12 mm thick copper base plate is adopted as the heat carrier for the heat […]
Wavelength Compression Mechanism, High-Speed Routing Optimization, and Thermal Co-Design for 224G+ PAM4 Optical Modules
1. Introduction Thermal design for opticalmodules.With the rapid iteration of 800G and 1.6T high-speed optical interconnection systems, 224Gbps PAM4 has become the mainstream single-lane transmission standard for next-generation optical modules, silicon photonic chips, and thin-film lithium niobate modulators. Unlike traditional low-speed digital signals that are merely restricted by rise time and impedance matching, ultra-high-frequency signals […]
Copper Tube Embedded Cold Plate vs Vacuum Brazed Cold Plate: Thermal Performance & Application Boundary Analysis (2026)
Our engineers conduct an in-depth comparison among copper tube embedded cold plates, vacuum brazed cold plates and friction stir welded copper cold plates. We analyze differences in thermal resistance, temperature uniformity, pressure drop, reliability and cost across multiple dimensions, delivering optimal liquid cooling selection references for electronic thermal management engineers. Core Keywords: liquid cold plate, […]