A natural cooling heat sink-extrusion process made

A natural heat dissipation scheme is adopted. The power of the heating chip in the whole case is relatively low, not more than 10W. Moreover, the plastic shell with high thermal conductivity is used as a reference for radiation.The plastic shell with high thermal conductivity is used as a reference for radiation. Overall, the customer requires the temperature of the shell and bottom shell to be no more than 55 degrees. The following is the design data shared.

System Conditions :

•Thermal Power:6.6W;

•Thermal pad ( thermal conductivity) =5W/m.k

• PCB Therml conductivity=10.0W/m.k

•Heatsink/Al6063-T5 /65mm X 63mm X 14.4mm

•Nylon material for case shell

•Natural convection heat dissipation

•Environment 40℃

The design size of the shell is 120x120x65mm

Ansys16.0 design model                                                                        

Basic Parameter Setting

•Ambient temperature 40 ℃

•Thermal radiation is considered

•Laminar flow regime

•Gravity vector /Z

•Operating pressure 101325N/m2 on Natural convection

•The number of meshes is 597503

•Set uniform mesh params

•Mesh assemblies separately

•Allow multi-level meshing

•Allow minimum gap changes

•The temperature distribution corresponding to these components

•The temperature distribution corresponding to these components