NVIDIA H200 GPU server immersion oil cooling solution
In the era of explosive AI computing power, GPUs, as core computing units, face significant challenges in hardware stability and computing power output due to their heat dissipation efficiency. The power consumption of NVIDIA‘s H200 GPU varies depending on model and usage scenario. The standard model has a thermal design power (TDP) of 700W. The […]
A Guide from Fluid Characteristics to Industry Practices
Coolant Selection and Material Compatibility: A Guide from Fluid Characteristics to Industry Practices.In industrial heat dissipation, electronic cooling, or precision equipment temperature control scenarios, the selection of coolants directly determines system stability and service life. Among the key decision-making factors, fluid-material compatibility and corrosion control are the core dimensions. This article starts from the characteristics […]
Analysis of vacuum brazing process characteristics of aluminum alloy
The core content of this article is to explain the characteristics of aluminum alloy vacuum brazing process，Overview of the basic characteristics and vacuum brazing of two types of aluminum alloys 3003 and 6o61. 3003 aluminum alloy is an Al-Mn series alloy, which has good corrosion resistance and formability, but cannot be strengthened by heat treatment. […]
The SURTEC 650 treatment for heat sinks
SURFACE COATING: SURTEC 650 treatment refers to a type of surface coating treatment process that uses Surtec 650 passivation solution. Surtec 650 is a trivalent chromium passivation solution for aluminum and aluminum alloys, and can also be used for conversion coating of magnesium alloys. Apart from its practical application being of great significance, the surface […]
How to select a heat sink
As the heat released by microelectronic devices goes up and their overall sizes get smaller and How to select a heat sink？ thermal management turns into a far more vital part of electronic product design. The operational reliability and service life of electronic equipment both have an inverse connection with the temperature of the equipment’s components. […]
The Importance of Thermal Interface Materials in Thermal Management
The Importance of Thermal Interface Materials in Thermal Management: Understanding the Key Selection Logic from a Thermal Analysis Case of High-Power Equipment With the continuous increase in the power density of electronic devices, heat dissipation issues of high-power chips and industrial power modules have become a core bottleneck restricting equipment reliability. The primary goal of […]
The “Flow Commander” in AI Data Center Thermal Management: Technical Analysis and Future Outlook of Manifolds
Amid the explosive growth of AI computing power, the power density of individual server racks in data centers has surged from the traditional 5-10kW to over 50kW, with some AI cluster racks even exceeding 100kW. Such high power density has made thermal management a core bottleneck restricting the stable operation of data centers. Liquid cooling […]
Design and Application of High-Power TEC Heat Sinks
Abstract Design and Application of High-Power TEC Heat Sinks – Catering to Temperature Control Requirements of Medical Precision Instruments.With the rapid development of the medical industry and precision instrument field, the sensitivity and precision requirements of equipment for temperature control have significantly increased. Especially in scenarios where the temperature needs to be lower than the […]
How to choose the interface materials of liquid cooled plates
As the core of AI computing power, NVIDIA’s H100 GPU generates extremely high heat density—like a “heat bomb”—when operating at full load with 750W.The importance of interface materials in high-power liquid cooled plates. If the thermal interface material is improperly selected, the core temperature may exceed 120°C, triggering immediate thermal throttling and even shortening the […]