High-power liquid cooling plates are utilized for dissipating heat from 1500W IGBT modules or PV inverters.

Key words: 1500W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:300x300x22mm; Material: Aluminum6063-T5; Cooling capacity:1500W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
Advanced liquid cold plate designed for efficient cooling of 950W IGBT chipsets.

Key words: 950W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:230x230x22mm; Material: Aluminum6063-T5; Cooling capacity:950W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
Friction stir welding process water cooling plate, used for 560W IGBT chipset heat dissipation.
Key words: 560W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:170x170x19mm; Material: Aluminum6063-T5; Cooling capacity:560W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
Efficient liquid cold plate,Solve the heat dissipation problem of 600W IGBT module

Key words: 600W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:150x230x19mm; Material: Aluminum6063-T5; Cooling capacity:600W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
Cold plate liquid cooling technology has been developed, featuring a 500W liquid cooling plate designed for efficient chipsets heat dissipation.

Key words: 500W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:150x170x19mm; Material: Aluminum6063-T5; Cooling capacity:500W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
A supplier of cold plate, offering complimentary samples, has developed a chipset-cooling water cooling plate capable of handling 1100W.

Key words: 1100W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size: 140x300x19mm; Material: Aluminum6063-T5; Cooling capacity:1100W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps […]
An efficient water cooling plate is developed for heat dissipation of 450W laser module.

Key words: 450W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:120x120x19mm; Material: Aluminum6063-T5; Cooling capacity:450W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to […]
The standard cold plate is provided to achieve high-performance heat dissipation for 400W IGBT.

Key words: 400W IGBT Liquid Cold Plate Process of production:Friction stir welding or brazing process; Cold plate size:80x170x19mm; Material: Aluminum6063-T5; Cooling capacity:400W In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps […]
Water cooling plate thermal management experts, specializing in the production of a liquid cold plates for cooling 300W chipsets

Key words: Process of production:Friction stir welding or brazing process; Cold plate size:100x100x19mm; Material: Aluminum6063-T5; In the process of actual design, engineers will select various specifications of IGBT modules. The challenge lies in designing an IGBT water cooling plate that can deliver optimal heat dissipation performance.In general, there are several steps to consider in relation to the cooling […]