Comparative Study on Performance and Engineering Application of Graphite Sheet and Liquid Metal as Thermal Interface Materials
Abstract With the continuous increase in heat flux density of high-power chips, power devices and microchannel heat dissipation systems,thermal interface material， the selection of thermal interface materials (TIMs) directly determines the heat dissipation efficiency and long-term operational stability of equipment. To clarify the engineering adaptation boundaries between two mainstream high-end thermal interface materials, namely graphite […]
Huawei Tau (τ) Law: The Underlying Thermal Management Revolution Reshaping the Post-Moore Era from the Time Dimension
Abstract For decades,microchannel cooling technology ，the development of the semiconductor industry has been driven by process scaling, which continuously shrinks transistors to improve chip computing power. However, as semiconductor manufacturing processes approach physical limits, concentrated challenges such as quantum leakage, surging process complexity, and runaway manufacturing costs have rendered the traditional Moore’s Law iteration path […]